High Efficiency wiReless CMOS transceiver boosted by artificial intelligencE for 6G bandS and beyond

The future of wireless communications will go beyond connecting people or things to connecting smart robots or unmanned vehicles without human intervention. Only sub-THz frequencies can offer the spectrum to achieve unprecedented communication throughput.

Yet current technologies suffer from barriers that prevent mass-market operations, such as high cost, limited bandwidth or power-hungry hardware not compatible with autonomous systems.

HERMES proposes the fusion of Artificial Intelligence (AI) and deep sub-micron CMOS technology to open a new generation of wireless transceivers.

The project will focus on sub-THz frequencies between 140 and 160GHz, and will break new ground in the conversion of information from digital to THz using European CMOS technology to develop a highly integrated transceiver.

For the first time, HERMES will deliver to the telecommunications industry a disruptive way of designing transceivers, with impact on production of billions of units that can be implemented in any autonomous system to communicate. This new wireless link will be a springboard for an innovation leap in the robotics and the security industry.

Our ambitious and risky approach goes significantly beyond the SoA: we will demonstrate that the power of AI developed by computer sciences research and associated with an original electronics signal processing technique can push CMOS technology to release outstanding performances.

The project will produce a chipset of a low-cost radio that exchanges tens of Gbps and will test it in use cases of unmanned vehicles applied to maritime border surveillance operated by civil authorities.

The HERMES consortium brings together 6 partners from 5 European countries bridging the full value chain of academic research, technology transfer and industry.