Completed Development AidData Chinese Aid

Bank of China provides loan worth 78.8 million lei to Moldtelecom for technological upgrades (Linked to Record IDID#66611, ID#66614, ID#66617)

$78.8M USD

Funder	Bank of China (BOC)
Recipient Organization	Moldtelecom
Country	Moldova
Start Date	Jan 01, 2010
End Date	Oct 05, 2028
Duration	6,852 days
Number of Grantees	1
Roles	Recipient
Data Source	AidData Chinese Aid
Grant ID	`66618`

Grant Description

Bank of China provides loan worth 78.8 million lei to Moldtelecom for technological upgrades In 2010, the Bank of China issued a loan worth 78.8 million Lei to Moldtelecom — a state-owned telecommunications operator — to facilitate its acquisition of telecommunications (3G) equipment and post-warranty services from Huawei.

📋 Loan / Grant Terms

💰 Loan Amountare unknown

By the end of 2010, Huawei and Bank of China had collectively lend Moldtelecom 236.8 million lei, which was equivalent to 30.8% of all of the outstanding debt obligations of Moldtelecom (as compared to 148.6 million lei in 2009).

📋 Staff Comments

Bank of China issued two separate loans to Moldtelecom in 2010. The other loan is captured in Project ID#66617.
The loan was part of a larger package of loans and supplier credits that Bank of China and Huawei issued to Moldtelecom (see Project ID#66611, ID#66614, ID#66617).

📚 Sources & References

THE REPORT audit of the Joint Stock Company 'Moldtelecom' for the years 2009-2010 (RAPORTUL auditului la Societatea pe Acţiuni „Moldtelecom” pentru anii 2009-2010) Loan applications and disbursements are still being received and processed as the projects continue to evolve. Ongoing monitoring and evaluation are in place to ensure project continuity.

All Grantees

Moldtelecom

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