Challenges in micro and nano fabrication

This project focuses on developing novel advanced compound semiconductor active and passive devices and intergraded circuits using nanofabrication and microfabrication modules in a cleanroom environment targeting vertical integration and enhancing performance.

This work will include different nanofabrication and microfabrication techniques, such as nanometre scale e-beam lithography pattering on unlevelled surfaces, 3D e-beam lithography technology and nanometre scale compound semiconductors to enhance performance and increase fabricated device density per unit area.

The project will also investigate the use of dielectrics to develop vertical on integration for multiple level fabrication and on-chip packaging considering thermal challenges.