Beamforming Integrated Sub-THz Compact circUITS - BISCUITS

The exponential growth in data rates and capacity of wireless systems needs more bandwidth, which can be found at higher frequencies. In 5G systems the mm-wave range was therefore deployed.

In 6G there are plans to start using sub-THz frequencies, i.e. above 100GHz.At the core of this development are integrated circuits (chips) capable of sub-THz beamforming when connected to antenna arrays.

To address the consumer market the chips should be fabricated in low cost CMOS technology, which also brings high integration level, so that each chip can handle signals for many antennas to reduce the chip count and packaging costs, and also contain digital functions. Due to the short wavelength at sub-THz, the space between antenna elements becomes very small.

The electronics for each antenna element must then also be very compact, and for a dual polarized array with a conventional lambda/2 spacing operating at 150GHz, two beamforming transceiver front-ends must fit within just 1 mm2 of chip area.Compact front-ends will therefore be investigated.

To reduce chip area and increase the dynamic range, the phase shifting functionality will be combined with interstage matching networks in the low noise amplifiers and power amplifiers. The antenna switch will be combined with the amplifier input and output matching networks. There will be 3 tapeouts in 22nm FDSOI technology, with increasing circuit complexity.

The circuits will be characterized in the new sub-THz lab at Lund University.