Internal Copper recycling for printed circuit boards

Purpose and goal:

The purpose of the project was to further develop a process for the reuse of copper that is being etched during printed circuit board manufacturing, which has previously been sent externally for central recycling. The project has successfully developed a new electroplating process that meets the technical and quality requirements for redissolving the pure and solid Copper material being plated.

Expected results and effects:

The project has shown that plated Copper can be formed into a rod which in turn can be cut into smaller pieces, with similar dimensions that printed circuit board manufacturers have previously had to buy in from an external source. The developed process now enables self-sufficiency on the majority of Copper that is coated on the circuit boards before the conductors are etched.

Approach and implementation:

The project has made extensive theoretical analyzes and simulations, and then carried out tests in laboratory equipment and on a smaller manufacturing scale. Configuration of process settings has been tested and verified to ensure the right quality and technical conditions. The project has also included construction and design work that enables the implementation of the new process with Sigma´s existing customers, as well as for new ones.