2D- Electrically Conductive Adhesive (2D-ECA) for low cost flexible electronics and thermoelectrics

Purpose and goal:

The main objective of this project was to develop a novel soft electrically conductive adhesive (ECA) based on 2D-materials to enable a new manufacturing process to fabricate thermoelectric modules. With a resistance of <10 m and strength of 45 N/mm2 for a single joint on a copper coated flexible polyimide substrate, the 2D-ECA has superior properties compared to the existing ECAs and multi-leg module manufacturing has also been demonstrated. The new composition does not contain any hazardous components which are common in commercial solders. Expected results and effects:

With the new 2D-ECA and automated manufacturing through dispenser and pick and place machine, ParsNord forecasts to increase the production rate of TEMs and decrease the overall cost of the system up to 50%. Besides, the 2D-ECA significantly enhances mechanical flexibility compared to the conventional solders thus enabling the entry of TEMs in major self-powered wireless sensors and industrial IOT.

The application of 2D-ECA can also be expanded to new areas such as hybrid printed electronics, wearable electronics, and stretchable electronics. Approach and implementation:

With the expertise in the synthesis of high quality 2D materials from IMRA, and the expertise of LiU on organic conducting adhesive, we have used the exfoliated 2D conductors (metal-sulfides and MXenes) into an organic binder to obtain novel 2D-electrical conducting adhesive (2D-ECA) with high electrical conductivity, softness, and good adhesion. After the synthesis and characterization of those 2D-ECAs, RISE intends to use this technology in the pilot line for printing and electronics together with ParsNord to fabricate flexible thermoelectric modules.