Revealing and Exploiting Moiré Interface Dynamics via Optical Spectroscopy

Understanding the arrangement of atoms when individual atomic sheets are combined is crucial for unlocking their unique optical and electronic properties.

Recent advances in 2D transition metal dichalcogenides, such as sliding ferroelectricity, have opened new avenues for exploring these properties under varying electric fields.

My project, Revealing and Exploiting Moir Interface Dynamics via Optical Spectroscopy (REMIDOS), aims to investigate and control how atomic arrangements influence the optical and electronic behaviors in moir heterostructures materials in which atomic layers are stacked with a slight relative twist or lattice mismatch.

To achieve this, I will develop a novel technique called oblique incidence second-harmonic generation, which enables precise probing of the atomic configurations at twisted interfaces.

By studying how electric fields alter these configurations and the resulting changes in optical and electronic properties, my research will provide deeper insights into the fundamental mechanisms governing these materials.This fellowship will significantly advance my expertise in cutting-edge 2D material systems and optical measurement techniques, enhancing my publication record and positioning me as a leading researcher poised for an independent career.

In addition, I will gain valuable transferable skills, including project management, supervision, and effective scientific communication, through interdisciplinary collaborations and structured training programs.

The outcomes of this project are expected to offer transformative insights into atomic registries in moir materials and potentially identify an electronic switch, paving the way for innovative applications in quantum devices and optoelectronics.

Moreover, the development of this non-destructive probing technique could become a standard tool for researchers in the field, broadening the impact across condensed matter physics, materials science, and photonics.