Holey Anodic Alumina and Silicon-Germanium Based Thermoelectric Modules - An Eco-Friendly, Sustainable, and Cost-Effective Solid-State Solution for Energy Harvesting and Active Cooling

The European Green Deal targets zero net greenhouse gas emissions by 2050, emphasizing clean energy and improved energy efficiency.

In line with this objective, the HoleySTeM project focuses on waste heat recovery and cooling solutions, which are crucial given that two-thirds of global energy production is wasted via heat losses, and cooling accounts for 10% of greenhouse gas emissions.

The HoleySTeM focuses on developing nanostructured silicon-germanium-based thermoelectric modules (TEMs) for near-room-temperature applications on nanoporous alumina substrates.

This approach draws on so-called ""Holey Silicon"", which uses nanometric holes to enhance thermoelectric efficiency by inhibiting phonon transport through nanopores.

Intended as solid-state devices for recovering waste heat and cooling electronics, these modules will be created with advanced designs for thermoelectric generators (TEGs) and coolers (TECs), optimized through multiphysics simulations, and fabricated using magnetron sputtering—a scalable and economical method.If successful, HoleySTeM could replace Bi, Te, Pb, Sb, and Se-based TEMs with SiGe-based eco-friendly and abundant alternatives, reducing material and production costs, expanding potential applications, and simplifying integration with modern electronics.

HoleySTeM also addresses Key Enabling Technologies (KETs) under Horizon Europe (2021-2027), including micro/nano-electronics, advanced materials, and advanced manufacturing.This MSCA offers a career development opportunity for Dr. Ketan Lohani (KL), mentored by Prof. Alfonso Cebollada at the Institute of Micro and Nanotechnology, Spanish National Research Council (IMN-CSIC) in Madrid.

KL will apply his prior knowledge in thermoelectric materials to fabricate functional TEMs using experimental and computational methods.

This MSCA will equip him with advanced skills in vacuum deposition, nanofabrication, and device design simulations, significantly advancing his career.