The first-ever mask-based technology for faster, precise, and sustainable printing of 3D interconnects for the display and semiconductor packaging industry.

At Fonontech, our vision is to pioneer a transformative and sustainable era in semiconductor packaging industry through our proprietary cutting-edge technology, Impulse Printing.

Originating from extensive research and development at the Dutch leading Applied Research Institute TNO, the Impulse Printing technology has the unprecedented scalability, accuracy, and throughput for both 2D and 3D interconnect printing for the billion-dollar semiconductor and micro-LED packaging industry.

The technology can attain feature sizes ranging from <10 m to >100 m in 3D, with the highest throughput and lowest cost of ownership, providing major competitive edge particularly in the critical lower feature range essential for enabling product miniaturization. Impulse Printing, distinguished by minimal cost of ownership and facility footprint, is safeguarded by 14 patents.

It is slated for direct sales to high-volume electronic device manufacturers or through system integrators securing the company a revenue of 533 M by 2030.