Collaborative Innovation in 3D VLSI Reliability

The overarching goal of COIN-3D is to foster strategic networking and knowledge exchange between UTH and leading European research institutions to enhance research management and commercialization capacities in the area of 2.5/3D chiplet architectures.

To achieve this objective, the project will establish strong partnerships with European counterparts and create a space for collaborative learning and experience sharing.

Additionally, the project will develop tailored training programs and resources to equip UTH researchers and administrative staff with the necessary skills for effective research management and successful commercialization endeavours.

The main target of the COIN-3D project is to enhance the research capacity of an entity being active in a widening country with the assistance of more developed countries trying to expose the pathways for innovation and research excellence.

Through these initiatives, the project aims to elevate UTH's research profile, stimulate innovation, and contribute to the institution's strategic positioning within the global research community.

In addition, our vision aligns seamlessly with the objectives of the European Chips Act , as we work towards cultivating a vibrant ecosystem for semiconductor research, development, and commercialization.

A wide number of twinning activities are foreseen, and a strong interaction plan is already in place together with core research activities that can be beneficial for the entire consortium.

Our core research plan is moving around one of the most significant research directions in the area of 2.5/3D VLSI systems reliability, i.e., the provision of novel EDA reliability tools for 3D VLSI designs, through the integration of innovative algorithms for physical-level and system-level reliability assessment, optimizing power delivery networks, and modelling aging phenomena, thereby advancing the state-of-the-art in semiconductor system design and ensuring long-term reliability.