BOOSTER PACKAGING FOR EUROPE

Pack4EU’s objectives are (1) the creation of the “Pan European network on advanced semiconductor packaging”, and (2) give guidance and deliver the awaited urgent results through policy recommendations, the “Advanced Semiconductor Packaging Master Plan for Europe”, addressing investments, pilot lines, competence centers and further coordination actions dedicated to semiconductor packaging and the EU green deal.This will be worked on by a consortium gathering all the industry associations including the scientific ones supported by 40 associated partners all along the value chain.

This group will first create a European definition of advanced semiconductor packaging illustrated by visuals and glossary.

The tasks are: build the “who’s who” of advanced semiconductor packaging, involve SMEs, Start-ups and Scale-ups, RTOs; map the entire supply chain from design, materials, equipment, fabs, and all the way to test and reliability; engage with MS, Regions and the specific agencies to consolidate the policies; study the other Chips Acts deployed in non-member countries and assess the existing European position in the global packaging world, for the most pertinent European needs and applications; aggregate the recent past similar actions at national or regional clusters level; engage with world leading OSATs and European stakeholders to reconsider manufacturing in Europe; assess the gaps in education and skills required for human resources geared towards advanced packaging and citizen’s awareness.Objectives for guidance also include the Chips-packaging diplomacy, autonomy but no isolation, partnering with competencies from all over the world, vulnerability and sovereignty issues, for a decade long vision and a resilient European industrial infrastructure, making it possible to create local economic strengths, to create local jobs and to maintain and reinforce local advanced know-how and expertise in the long run while reinforcing European leadership in the race to