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Active HORIZON European Commission

Dynamic and reconfigurable data centre networks with modular optical subsystems

€6.02M EUR

Funder European Commission
Recipient Organization Teknologian Tutkimuskeskus Vtt Oy
Country Finland
Start Date Aug 01, 2022
End Date Jul 31, 2026
Duration 1,460 days
Number of Grantees 10
Roles Participant; Coordinator; Associated Partner
Data Source European Commission
Grant ID 101070342
Grant Description

DYNAMOS develops fast (1 ns) and widely tunable (>110 nm) lasers, energy-efficient (~ fJ/bit), broadband (100 GHz) electro-optic modulators, and high-speed (1 ns) broadcast-and-select packet switches as photonic integrated circuits (PICs).

DYNAMOS meets the expected outcome objectives and call scope by proposing the development of low energy (few pJ/bit) PICs, which are integrated into modular and scalable subsystems, and subsequently utilized to demonstrate novel data centre networks with highly deterministic sub-microsecond latency to enable maximum congestion reduction, full bisection bandwidth (lower congestion) and guaranteed quality of service while reducing cost per Gbps.

The proposed network offers optical circuit switched reconfiguration and guaranteed (contention-less) full-bisection bandwidth, allowing any computational node to communicate to any other node at full-capacity.

DYNAMOS builds on recent developments in III-V optoelectronics, thick silicon-on-insulator waveguide technology, and silicon organic hybrid (SOH) modulators.

It co-develops the entire ecosystem of transceivers, switches and networks to boost overall performance and to reducing the total cost of data exchange, instead of focusing on the improvement of individual optical links or interfaces.

The objectives of DYNAMOS perfectly match the major photonics research & innovations challenges defined in the Photonics21 Multiannual Strategic Roadmap 2021-2027.

All Grantees

Resolute Photonics Limited; Silorix Gmbh; Teknologian Tutkimuskeskus Vtt Oy; Senko Advanced Components (Euro) Ltd; Almae Technologies; E 4 Computer Engineering Spa; Argotech As; University College London; Ligentec Sa; Huawei Technologies France

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