High Speed Communication Links Based on Heterogeneous Chips

The constant hunger for data is straining optical links causing optical chip makers to struggle. Transceivers have to work at everincreasing symbol rates. On top they need to handle more complex data formats. New materials have to be sought after as current modulator technologies in e.g. silicon are reaching their limit.

In the COMb project, we will leverage recently obtained results to make ultra-high-speed transceivers based on the multi-material integration of Indium Phosphide and Lithium Niobate on a silicon nitride platform.

By exploiting mode-locked lasers and using a large number of lines higher data rates can be transmitted over the same channel. By heterogeneously integrating the source with a Lithium Niobate modulator very high symbol rates can be obtained.