Development of the next generation of 3D printed EMI shielding solutions based on 2D nanomaterials inks

With the fast development of wireless communication, especially the new 5G technology, electromagnetic interference (EMI) shielding is becoming a challenge.

High-performance EMI shielding materials are urgently needed in controlling electromagnetic radiation pollution that seriously affects the normal operation of sensitive electronic apparatus and systems. Metals are the most used shielding materials but suffer from easy corrosion, high density, and poor processibility.

Despite the progress, most current research still concentrates on the solo enhancement of the EMI SE.

To enable new EMI shielding applications for next-generation devices, multifunctionality and low reflection feature are also important for shielding material, which can significantly improve the application adaptability and reduce the secondary EMI pollution, respectively. Unfortunately, most of the present EMI shielding solutions cannot simultaneously integrate these characteristics.

Therefore, pioneering alternative design and fabrication strategies for developing next-generation high-performance shielding materials beyond the usual protocols are urgently needed to meet the escalating demands of modern devices.

Furthermore, as a critical component in electronic devices and equipment, EMI shielding materials also meet great challenges from the miniaturization aspect. 2D nanomaterials are promising for EMI-shielding applications due to their outstanding electrical, thermal, and mechanical properties, versatile surface chemistry and their favourable capability to be assembled into macroscopic architectures or serve as conductive fillers for composite fabrication.

The aim of this project is to determine the economic and technical feasibility of using readily scalable additive manufacturing technologies for the development of highly efficient and customizable EMI shielding solutions based on two-dimensional (2D) nanosheets for electronic applications.